The recommended PCB footprint for the IXFP180N10T2 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
While the IXFP180N10T2 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and design considerations. However, it's essential to consult with Littelfuse's application engineers for specific guidance.
To ensure the reliability of the IXFP180N10T2 in high-temperature environments, it's essential to follow proper derating guidelines, provide adequate heat sinking, and ensure that the device is operated within its specified temperature range (up to 150°C). Additionally, consider using a thermally conductive interface material and a heat sink with a thermal resistance of less than 10°C/W.
Yes, the IXFP180N10T2 can be paralleled for higher current applications, but it's crucial to ensure that each device has its own individual heat sink and that the devices are matched for current sharing. Additionally, the user should consult with Littelfuse's application engineers to determine the optimal paralleling configuration and to ensure that the devices are operated within their specified ratings.
The IXFP180N10T2 should be stored in a dry, cool place away from direct sunlight and moisture. It's essential to handle the devices by the body and not the leads to prevent damage. Additionally, the devices should be stored in their original packaging or in a similar anti-static package to prevent electrostatic discharge (ESD) damage.
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IXFP180N10T2 Overview
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