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IXFP22N65X2M - LITTELFUSE

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IXFP22N65X2M - LITTELFUSE  - 3D model
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IXFP22N65X2M Details

  • Manufacturer Part Number:

    IXFP22N65X2M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    22 A

  • Drain-source On Resistance-Max:

    0.145 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.3 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    37 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFP22N65X2M Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFP22N65X2M is a standard TO-263 (D2PAK) footprint with a minimum pad size of 4.5mm x 2.5mm and a thermal pad size of 3.5mm x 2.5mm.
  • Yes, the IXFP22N65X2M is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, it is recommended to provide a thermal path from the device to a heat sink or the PCB, and to follow the thermal design guidelines provided in the datasheet. A minimum thermal resistance of 10°C/W is recommended.
  • The maximum allowed voltage transient for the IXFP22N65X2M is 80V for a duration of 100ns, as specified in the datasheet.
  • Yes, the IXFP22N65X2M can be used in a parallel configuration to increase current handling, but it is recommended to ensure that the devices are properly matched and that the thermal design is adequate to handle the increased power dissipation.

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IXFP22N65X2M Overview

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