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IXFX230N20T - LITTELFUSE

Description: MOSFET 230A 200V

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Symbol
IXFX230N20T - LITTELFUSE - PCB symbol
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PCB Footprints
IXFX230N20T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3
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3D Models
IXFX230N20T - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247-3
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IXFX230N20T Details

  • Manufacturer Part Number:

    IXFX230N20T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    5000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    230 A

  • Drain-source On Resistance-Max:

    0.0075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    60 pF

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1670 W

  • Pulsed Drain Current-Max (IDM):

    630 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFX230N20T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFX230N20T is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • The IXFX230N20T is rated for operation up to 150°C, but it's recommended to derate the current handling capability at higher temperatures. Consult the datasheet for specific derating curves.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the component is properly aligned and the solder joints are clean and free of oxidation.
  • The IXFX230N20T has a maximum surge current rating of 200A for 10ms, but this rating may vary depending on the specific application and operating conditions.
  • The IXFX230N20T is designed for high-frequency switching applications, but the maximum switching frequency is dependent on the specific application and operating conditions. Consult the datasheet for specific guidance.

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IXFX230N20T Overview

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