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IXTA08N100D2 - LITTELFUSE

Description: MOSFET N-CH MOSFETS (D2) 1000V 800MA

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PCB Footprints
IXTA08N100D2 - LITTELFUSE PCB footprint - Other - Other - TO-263 AA (IXTA)_2022
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3D Models
IXTA08N100D2 - LITTELFUSE  - 3D model - Other - TO-263 AA (IXTA)_2022
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IXTA08N100D2 Details

  • Manufacturer Part Number:

    IXTA08N100D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    21 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.5 pF

  • JEDEC-95 Code:

    TO-263AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTA08N100D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTA08N100D2 is a standard TO-220 package with a minimum pad size of 70 mil x 70 mil and a thermal pad size of 100 mil x 100 mil.
  • While IXTA08N100D2 is a fast-switching thyristor, it's not recommended for high-frequency switching applications above 10 kHz due to its limited dv/dt rating and potential for oscillation.
  • To ensure reliable operation of IXTA08N100D2 in high-temperature environments, it's essential to provide adequate heat sinking, maintain a maximum junction temperature of 150°C, and follow the recommended derating curves for temperature and voltage.
  • A recommended gate drive circuit for IXTA08N100D2 includes a gate resistor (RG) of 1 kΩ to 10 kΩ, a gate capacitor (CG) of 10 nF to 100 nF, and a gate voltage (VG) of 10 V to 15 V.
  • Yes, IXTA08N100D2 can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are matched for voltage and current ratings, and that the gate drive circuits are properly synchronized to prevent uneven current sharing.

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