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IXTA1R4N120P - LITTELFUSE

Description: Trans MOSFET N-CH 1.2KV 1.4A 3-Pin(2+Tab) D2PAK.,

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PCB Footprints
IXTA1R4N120P - LITTELFUSE PCB footprint - Other - Other - IXTA1R4N120P-1
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3D Models
IXTA1R4N120P - LITTELFUSE  - 3D model - Other - IXTA1R4N120P-1
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IXTA1R4N120P Details

  • Manufacturer Part Number:

    IXTA1R4N120P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    150 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    13 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    86 W

  • Pulsed Drain Current-Max (IDM):

    3 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTA1R4N120P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTA1R4N120P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXTA1R4N120P is rated for operation up to 150°C, but it's recommended to derate the device's current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or heat, which can damage the device.
  • The recommended wire size for connecting to the IXTA1R4N120P is 18 AWG to 20 AWG, depending on the current rating and distance of the connection.
  • Yes, the IXTA1R4N120P is suitable for high-frequency switching applications up to 100 kHz, but it's recommended to consider the device's switching losses and ensure proper heat sinking to prevent overheating.

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IXTA1R4N120P Overview

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