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IXTA220N04T2 - LITTELFUSE

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IXTA220N04T2 Details

  • Manufacturer Part Number:

    IXTA220N04T2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    600 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    220 A

  • Drain-source On Resistance-Max:

    0.0035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    250 pF

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    360 W

  • Pulsed Drain Current-Max (IDM):

    660 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTA220N04T2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTA220N04T2 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the PCB layout guidelines provided in the datasheet or application notes.
  • To ensure the reliability of IXTA220N04T2 in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, derating the device's power handling capabilities according to the temperature derating curve in the datasheet is crucial.
  • Yes, IXTA220N04T2 can be used in switching applications, but it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the switching frequency is within the recommended range. Additionally, proper snubber circuits and gate drive design are necessary to prevent ringing and ensure reliable operation.
  • To protect IXTA220N04T2 from overvoltage and overcurrent conditions, it's recommended to use a combination of overvoltage protection devices, such as TVS diodes or zener diodes, and overcurrent protection devices, such as fuses or current sense resistors. Additionally, implementing a robust gate drive circuit with built-in overcurrent protection can help prevent damage to the device.
  • Yes, IXTA220N04T2 is compatible with lead-free soldering processes. The device is RoHS compliant and can be soldered using lead-free soldering techniques, such as reflow soldering or wave soldering, following the recommended soldering profiles and guidelines.

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IXTA220N04T2 Overview

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