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IXTA36N30P - LITTELFUSE

Description: MOSFET MOSFET N-CH 300V 36A

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PCB Footprints
IXTA36N30P - LITTELFUSE PCB footprint - Other - Other - IXTA36N30P-2
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IXTA36N30P - LITTELFUSE  - 3D model - Other - IXTA36N30P-2
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IXTA36N30P Details

  • Manufacturer Part Number:

    IXTA36N30P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    300 V

  • Drain Current-Max (ID):

    36 A

  • Drain-source On Resistance-Max:

    0.11 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    90 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTA36N30P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTA36N30P is a TO-220 package with a minimum pad size of 70 mil x 70 mil and a thermal pad size of 100 mil x 100 mil.
  • While IXTA36N30P is a power MOSFET, it is not optimized for high-frequency switching applications. It has a relatively high gate charge and output capacitance, which may lead to high switching losses. For high-frequency applications, consider using a MOSFET with lower gate charge and output capacitance.
  • To ensure the reliability of IXTA36N30P in a high-temperature environment, follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below the maximum rated value of 150°C.
  • Yes, you can parallel multiple IXTA36N30P devices to increase current handling, but ensure that each device has its own gate resistor and that the gate signals are properly synchronized to prevent shoot-through currents.
  • The safe operating area (SOA) for IXTA36N30P is not explicitly stated in the datasheet, but it can be estimated based on the device's voltage and current ratings. As a general rule, operate the device within the boundaries of Vds = 30V, Id = 36A, and Pd = 100W to ensure reliable operation.

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IXTA36N30P Overview

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