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IXTA3N50D2 - LITTELFUSE

Description: MOSFET N-CH MOSFETS (D2) 500V 3A

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Symbol
IXTA3N50D2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTA3N50D2 - LITTELFUSE PCB footprint - Other - Other - TO-263 (IXTA)_2022
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3D Models
IXTA3N50D2 - LITTELFUSE - 3D model - Other - TO-263 (IXTA)_2022
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IXTA3N50D2 Details

  • Manufacturer Part Number:

    IXTA3N50D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    1.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    24 pF

  • JEDEC-95 Code:

    TO-263AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTA3N50D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTA3N50D2 is a standard TO-252 (D-PAK) footprint with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • While IXTA3N50D2 is a fast-switching MOSFET, it's not recommended for high-frequency switching applications above 100kHz due to its relatively high gate charge and output capacitance. For high-frequency applications, consider using a MOSFET with lower gate charge and output capacitance.
  • To ensure reliable operation of IXTA3N50D2 in high-temperature environments, make sure to follow the recommended derating curves for voltage and current, and consider using a heat sink or thermal management system to keep the junction temperature below 150°C.
  • Yes, IXTA3N50D2 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C. However, it's essential to follow the recommended soldering profile and ensure that the PCB and components can withstand the higher temperatures required for lead-free soldering.
  • Yes, IXTA3N50D2 can be used in a parallel configuration to increase current handling, but it's crucial to ensure that the MOSFETs are properly matched and that the gate drive and layout are designed to minimize current imbalance and oscillations.

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IXTA3N50D2 Overview

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