- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXTH10P50P
- Part Number IXTH10P50P
- Manufacturer LITTELFUSE
- Pin Count 3
- Part Category MOSFET (P-Channel)
- Package Category Transistor Outline, Vertical
- Footprint Name Transistor Outline, Vertical - TO-247
- Released Date Apr 18, 2024
- Last Modified Date Apr 18, 2024 10:38 AM UTC
- Pinout / Pin List Click Here (Member Only)
IXTH10P50P Details
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Manufacturer Part Number:
IXTH10P50P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Philippines
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
1500 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
IXTH10P50P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXTH10P50P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
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While the IXTH10P50P is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and thermal management. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements of your high-frequency application.
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To ensure the reliability of the IXTH10P50P in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and ensuring good airflow around the device. Additionally, the device should be operated within its recommended temperature range of -40°C to 150°C.
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Yes, the IXTH10P50P can be used in parallel to increase current handling, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced. Additionally, the user should consult with Littelfuse's application engineers to ensure that the parallel configuration meets the specific requirements of the application.
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The IXTH10P50P should be stored in a dry, cool place away from direct sunlight and moisture. The device should be handled with care to avoid mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent damage to the device.
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IXTH10P50P Overview
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