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IXTH120P065T - LITTELFUSE

Description: MOSFET -120 Amps -65V 0.01 Rds

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PCB Footprints
IXTH120P065T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247_11
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3D Models
IXTH120P065T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247_11
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IXTH120P065T Details

  • Manufacturer Part Number:

    IXTH120P065T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    65 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    505 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Pulsed Drain Current-Max (IDM):

    360 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH120P065T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH120P065T is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the PCB layout guidelines provided in the datasheet or application notes to ensure proper thermal performance and reliability.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of less than 10°C/W and a surface area of at least 10cm². The heat sink should be mounted using a thermal interface material with a thermal conductivity of at least 1W/m-K. Additionally, ensure good airflow around the heat sink and avoid blocking the airflow with other components or obstacles.
  • The maximum allowed case temperature for the IXTH120P065T is 150°C. Operating the device above this temperature can reduce its reliability and lifespan. It's recommended to design the system to keep the case temperature below 125°C to ensure optimal performance and reliability.
  • Yes, the IXTH120P065T is designed to withstand high-vibration environments. However, it's recommended to follow the recommended PCB mounting and screw torque guidelines to ensure the device is securely fastened to the PCB. Additionally, consider using a vibration-dampening material or a shock-absorbing mounting system to reduce the vibration stress on the device.
  • The IXTH120P065T has a high inrush current during startup due to its internal capacitance. To handle this, it's recommended to use a soft-start circuit or a current-limiting resistor in series with the input voltage to reduce the inrush current. Additionally, ensure the input voltage is ramped up slowly to reduce the inrush current peak.

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IXTH120P065T Overview

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