The thermal resistance of the IXTH130N20T is typically around 0.5°C/W (junction-to-case) and 1.5°C/W (junction-to-ambient) when mounted on a typical PCB.
Yes, the IXTH130N20T is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F). Also, make sure the PCB is designed with a sufficient thermal pad and clearance around the device.
The IXTH130N20T can withstand voltage transients up to 400V for a duration of 10ms, but it's recommended to limit transients to 300V or less to ensure reliable operation.
Yes, the IXTH130N20T can be used in a parallel configuration to increase the current handling capability, but it's essential to ensure that the devices are properly matched and that the PCB is designed to handle the increased current.
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IXTH130N20T Overview
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