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IXTH130N20T - LITTELFUSE

Description: MOSFET 130Amps 200V

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PCB Footprints
IXTH130N20T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXTH) Outline
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3D Models
IXTH130N20T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXTH) Outline
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IXTH130N20T Details

  • Manufacturer Part Number:

    IXTH130N20T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    130 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    122 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    830 W

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH130N20T Frequently Asked Questions (FAQs)

  • The thermal resistance of the IXTH130N20T is typically around 0.5°C/W (junction-to-case) and 1.5°C/W (junction-to-ambient) when mounted on a typical PCB.
  • Yes, the IXTH130N20T is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C (423°F). Also, make sure the PCB is designed with a sufficient thermal pad and clearance around the device.
  • The IXTH130N20T can withstand voltage transients up to 400V for a duration of 10ms, but it's recommended to limit transients to 300V or less to ensure reliable operation.
  • Yes, the IXTH130N20T can be used in a parallel configuration to increase the current handling capability, but it's essential to ensure that the devices are properly matched and that the PCB is designed to handle the increased current.

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IXTH130N20T Overview

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