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IXTH140P05T - LITTELFUSE

Description: MOSFET -140 Amps -50V 0.008 Rds

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IXTH140P05T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXTH140P05T
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3D Models
IXTH140P05T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - IXTH140P05T
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IXTH140P05T Details

  • Manufacturer Part Number:

    IXTH140P05T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    50 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    640 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Pulsed Drain Current-Max (IDM):

    420 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH140P05T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH140P05T is a standard TO-220 package with a minimum pad size of 0.2 inches x 0.2 inches and a thermal pad size of 0.4 inches x 0.4 inches.
  • Yes, the IXTH140P05T is rated for operation up to 150°C, but it's recommended to derate the current handling capability at higher temperatures to ensure reliable operation.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or heat, which can damage the device.
  • The recommended wire size for connecting to the IXTH140P05T is 18 AWG to 20 AWG, depending on the current handling requirements and the distance between the device and the power source.
  • Yes, the IXTH140P05T is designed to withstand vibrations up to 10 G, but it's recommended to secure the device properly to the PCB and ensure the PCB is mounted securely to the chassis to prevent damage.

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IXTH140P05T Overview

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