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IXTH26P20P - LITTELFUSE

Description: Trans MOSFET P-CH 200V 26A 3-Pin(3+Tab) TO-247

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PCB Footprints
IXTH26P20P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
IXTH26P20P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247
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IXTH26P20P Details

  • Manufacturer Part Number:

    IXTH26P20P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    26 A

  • Drain-source On Resistance-Max:

    0.17 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    100 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    70 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH26P20P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTH26P20P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, IXTH26P20P is rated for operation up to 150°C junction temperature, but it's recommended to derate the current handling capability at higher temperatures to ensure reliable operation.
  • To ensure reliability in a high-vibration environment, it's recommended to use a secure mounting method, such as screwing or clipping, and to follow proper PCB design and assembly guidelines to minimize mechanical stress on the device.
  • The recommended soldering profile for IXTH26P20P is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
  • Yes, IXTH26P20P can be used in a parallel configuration to increase current handling, but it's recommended to ensure that the devices are properly matched and that the PCB design and thermal management are adequate to handle the increased current.

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IXTH26P20P Overview

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