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IXTH50P10 - LITTELFUSE

Description: MOSFET -50 Amps -100V 0.055 Rds

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Symbol
IXTH50P10 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTH50P10 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXTH50P10
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3D Models
IXTH50P10 - LITTELFUSE - 3D model - Transistor Outline, Vertical - IXTH50P10
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IXTH50P10 Details

  • Manufacturer Part Number:

    IXTH50P10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    30 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    733 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH50P10 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH50P10 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • While the IXTH50P10 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and thermal management. However, it's essential to consult with Littelfuse's application engineers to ensure the device meets the specific requirements.
  • To ensure proper thermal management, it's recommended to use a heat sink with a thermal resistance of ≤ 1°C/W, and apply a thermal interface material (TIM) with a thermal conductivity of ≥ 1 W/m-K. Additionally, ensure good airflow around the device and avoid blocking the heat sink fins.
  • The IXTH50P10 has a maximum surge current rating of 100 A for 10 ms, which is sufficient for most industrial and automotive applications. However, it's essential to consult the datasheet and application notes for specific surge current requirements.
  • Yes, the IXTH50P10 can be used in parallel to achieve higher current ratings. However, it's crucial to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch.

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IXTH50P10 Overview

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