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IXTH52P10P - LITTELFUSE

Description: MOSFET -52.0 Amps -100V 0.050 Rds

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PCB Footprints
IXTH52P10P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO247_
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3D Models
IXTH52P10P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO247_
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IXTH52P10P Details

  • Manufacturer Part Number:

    IXTH52P10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    52 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    275 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTH52P10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH52P10P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXTH52P10P is rated for operation up to 150°C, but it's recommended to derate the current handling capability at higher temperatures to ensure reliable operation.
  • Proper cooling can be achieved by providing a sufficient heat sink, ensuring good thermal contact between the device and the heat sink, and maintaining good airflow around the device.
  • The IXTH52P10P has a maximum surge current rating of 100A for 10ms, but it's recommended to consult the datasheet for specific surge current ratings and duration.
  • Yes, the IXTH52P10P can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reduce reliability.

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IXTH52P10P Overview

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