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IXTH80N075L2 - LITTELFUSE

Description: DISC MOSFET N-CH LINEAR L2 TO-247AD / TUBE

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PCB Footprints
IXTH80N075L2 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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3D Models
IXTH80N075L2 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXFH) Outline_2021
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IXTH80N075L2 Details

  • Manufacturer Part Number:

    IXTH80N075L2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.024 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    325 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    357 W

  • Pulsed Drain Current-Max (IDM):

    180 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTH80N075L2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTH80N075L2 is a 5x6 pad layout with a thermal pad in the center. The pad dimensions are 0.5mm x 0.5mm with a 0.5mm spacing between pads.
  • Yes, IXTH80N075L2 is rated for operation up to 150°C junction temperature. However, the maximum power dissipation will decrease as the temperature increases.
  • The recommended soldering profile for IXTH80N075L2 is a peak reflow temperature of 260°C for 10-30 seconds, with a maximum of 3 reflow cycles.
  • Yes, IXTH80N075L2 is compatible with lead-free soldering. It meets the requirements of the RoHS directive.
  • The typical turn-on time for IXTH80N075L2 is around 10-20 ns, and the typical turn-off time is around 20-30 ns.

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IXTH80N075L2 Overview

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