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IXTK102N65X2 - LITTELFUSE

Description: IXYS IXTK102N65X2 N-channel MOSFET Transistor, 100 A, 650 V, 3-Pin TO-264P

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PCB Footprints
IXTK102N65X2 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (IXTK)
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3D Models
IXTK102N65X2 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 (IXTK)
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IXTK102N65X2 Details

  • Manufacturer Part Number:

    IXTK102N65X2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    650 V

  • Drain Current-Max (ID):

    102 A

  • Drain-source On Resistance-Max:

    0.03 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    12.6 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1040 W

  • Pulsed Drain Current-Max (IDM):

    204 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTK102N65X2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTK102N65X2 is a TO-263 (D2PAK) package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a soldering flux specifically designed for lead-free soldering. Also, ensure the PCB is clean and free of oxidation.
  • The maximum allowed voltage transient for the IXTK102N65X2 is 80V, as specified in the datasheet. Exceeding this value may damage the device.
  • The IXTK102N65X2 is rated for operation up to 150°C. However, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments to prevent overheating.
  • To calculate the power dissipation, use the formula: Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.

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IXTK102N65X2 Overview

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