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IXTK210P10T - LITTELFUSE

Description: MOSFET TrenchP Power MOSFETs

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PCB Footprints
IXTK210P10T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 AA HEIGHT 5.13
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3D Models
IXTK210P10T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-264 AA HEIGHT 5.13
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IXTK210P10T Details

  • Manufacturer Part Number:

    IXTK210P10T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    210 A

  • Drain-source On Resistance-Max:

    0.0075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1100 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1040 W

  • Pulsed Drain Current-Max (IDM):

    800 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTK210P10T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTK210P10T is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the IXTK210P10T is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure proper thermal management and follow the recommended derating guidelines.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a soldering flux compatible with the component's terminations. Avoid applying excessive force or heat, which can damage the component.
  • Store the IXTK210P10T in a dry, cool place, away from direct sunlight and moisture. Handle the components by the body, avoiding touching the leads or terminations to prevent damage or contamination.
  • Yes, the IXTK210P10T is designed to withstand vibrations and shocks. However, it's essential to ensure proper PCB design, component mounting, and mechanical fixation to prevent damage or dislodging.

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IXTK210P10T Overview

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