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IXTP102N15T - LITTELFUSE

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IXTP102N15T Details

  • Manufacturer Part Number:

    IXTP102N15T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.92

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    750 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    102 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    455 W

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP102N15T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTP102N15T is a standard TO-220 package with a minimum pad size of 70 mil x 70 mil and a thermal pad size of 100 mil x 100 mil.
  • Yes, the IXTP102N15T is designed for high-reliability applications and is qualified to AEC-Q101 standards for automotive use. However, it's essential to follow proper design, testing, and validation procedures to ensure the device meets the specific requirements of your application.
  • Proper thermal management is crucial for the IXTP102N15T. Ensure good thermal conductivity between the device and the heat sink, use a thermal interface material (TIM) if necessary, and provide adequate airflow around the device. The maximum junction temperature (Tj) is 150°C, and the thermal resistance (RθJA) is 40°C/W.
  • The safe operating area (SOA) for the IXTP102N15T is defined by the maximum voltage, current, and power dissipation ratings. The device can operate safely within the boundaries of Vds = 150V, Id = 10A, and Pd = 50W. However, it's essential to consider the specific application requirements and ensure the device operates within the recommended SOA to prevent damage or premature failure.
  • Yes, the IXTP102N15T can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the devices are properly matched, and the gate drive and layout are designed to minimize differences in switching times and voltage drops between the devices.

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IXTP102N15T Overview

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