Part Image

IXTP120P065T - LITTELFUSE

Description: MOSFET -120 Amps -65V 0.01 Rds

Download IXTP120P065T Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IXTP120P065T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IXTP120P065T
click to zoom
3D Models
IXTP120P065T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - IXTP120P065T
click to zoom

IXTP120P065T Details

  • Manufacturer Part Number:

    IXTP120P065T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.1

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    65 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    505 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Pulsed Drain Current-Max (IDM):

    360 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP120P065T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTP120P065T is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXTP120P065T is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper cooling, the IXTP120P065T should be mounted on a heat sink with a thermal resistance of ≤ 1°C/W, and the heat sink should be designed to provide adequate airflow.
  • The maximum allowed case temperature for the IXTP120P065T is 150°C, and it is recommended to keep the case temperature below 125°C for optimal performance and reliability.
  • Yes, the IXTP120P065T can be used in a parallel configuration to increase the current handling capability, but it is recommended to ensure that the devices are properly matched and that the thermal management is adequate.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXTP120P065T Overview

Use the download button to access the IXTP120P065T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTP1, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTP120P065T

Showing 0 results