The recommended PCB footprint for the IXTP120P065T is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, the IXTP120P065T is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
To ensure proper cooling, the IXTP120P065T should be mounted on a heat sink with a thermal resistance of ≤ 1°C/W, and the heat sink should be designed to provide adequate airflow.
The maximum allowed case temperature for the IXTP120P065T is 150°C, and it is recommended to keep the case temperature below 125°C for optimal performance and reliability.
Yes, the IXTP120P065T can be used in a parallel configuration to increase the current handling capability, but it is recommended to ensure that the devices are properly matched and that the thermal management is adequate.
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IXTP120P065T Overview
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