The recommended PCB footprint for IXTP26P20P is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
Yes, IXTP26P20P is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
To ensure the thermal performance of IXTP26P20P, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W and to maintain a maximum junction temperature of 150°C.
Yes, IXTP26P20P is compatible with lead-free soldering and meets the requirements of RoHS and WEEE directives.
The maximum surge current rating of IXTP26P20P is 100A for 10ms, making it suitable for use in applications with high inrush currents.
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IXTP26P20P Overview
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