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IXTP32P05T - LITTELFUSE

Description: MOSFET 32 Amps 50V 0.036 Rds

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PCB Footprints
IXTP32P05T - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220-AB
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3D Models
IXTP32P05T - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO220-AB
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IXTP32P05T Details

  • Manufacturer Part Number:

    IXTP32P05T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.15

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    200 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    50 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.039 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    160 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    83 W

  • Pulsed Drain Current-Max (IDM):

    110 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP32P05T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTP32P05T is a rectangular pad with dimensions of 1.5mm x 2.5mm, with a thermal pad of 2.5mm x 2.5mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • While the IXTP32P05T is a high-quality device, it's not specifically designed for high-reliability or aerospace applications. For such applications, it's recommended to use devices that meet specific standards, such as MIL-PRF-19500 or NASA-approved components. However, Littelfuse does offer other products that meet these standards, so it's best to consult with their sales team or application engineers for guidance.
  • To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, with a dwell time of 10-30 seconds. Use a solder with a melting point of 220°C or higher, and apply a solder flux to the pads before soldering. Additionally, ensure the PCB is clean and free of oxidation to promote good solder wetting.
  • The IXTP32P05T is designed to withstand voltage transients up to 40V for a duration of 100ms. However, it's essential to note that repeated or sustained voltage transients above the maximum rating can affect the device's reliability and lifespan. If your application requires withstanding higher voltage transients, consider using a TVS diode with a higher voltage rating.
  • While it's technically possible to use multiple IXTP32P05T devices in parallel, it's not recommended. The device's internal structure and thermal design are not optimized for parallel operation, which can lead to uneven current sharing, reduced reliability, and increased thermal stress. Instead, consider using a single device with a higher current rating or consult with Littelfuse's application engineers for guidance on selecting the appropriate device for your application.

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IXTP32P05T Overview

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