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IXTP3N100D2 - LITTELFUSE

Description: MOSFET N-CH MOSFETS (D2) 1000V 3A

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Symbol
IXTP3N100D2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTP3N100D2 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (IXTP)
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3D Models
IXTP3N100D2 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (IXTP)
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IXTP3N100D2 Details

  • Manufacturer Part Number:

    IXTP3N100D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    17 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    125 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTP3N100D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTP3N100D2 is a TO-263 (D2PAK) package with a minimum pad size of 4.5mm x 3.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, the IXTP3N100D2 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper soldering, follow the recommended soldering profile of 260°C for 10 seconds, and use a solder with a melting point of 217°C to 221°C. Also, ensure the PCB is designed with a sufficient thermal relief to prevent thermal stress on the device.
  • The maximum allowed voltage transient for the IXTP3N100D2 is 100V for a duration of 100ns, as specified in the datasheet. Exceeding this limit may damage the device.
  • Yes, the IXTP3N100D2 can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched and that the PCB is designed to handle the increased current and thermal requirements.

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IXTP3N100D2 Overview

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