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IXTP44P15T - LITTELFUSE

Description: Trans MOSFET P-CH 150V 44A 3-Pin(3+Tab) TO-220

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Symbol
IXTP44P15T - LITTELFUSE - PCB symbol
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PCB Footprints
IXTP44P15T - LITTELFUSE PCB footprint - Other - Other - TO-220AB (IXTP)
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3D Models
IXTP44P15T - LITTELFUSE - 3D model - Other - TO-220AB (IXTP)
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IXTP44P15T Details

  • Manufacturer Part Number:

    IXTP44P15T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.88

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    44 A

  • Drain-source On Resistance-Max:

    0.065 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    183 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    298 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTP44P15T Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXTP44P15T is a standard TO-220 package with a minimum pad size of 70 mils x 70 mils. It's recommended to follow the manufacturer's recommended land pattern to ensure proper thermal performance and reliability.
  • While IXTP44P15T has a high junction temperature rating of 150°C, it's essential to consider the thermal management of the device in high-temperature environments. Ensure proper heat sinking and thermal design to prevent overheating and ensure reliable operation.
  • To select the correct heat sink for IXTP44P15T, consider the device's power dissipation, ambient temperature, and desired junction temperature. Use a heat sink with a thermal resistance of ≤ 10°C/W to ensure reliable operation. Consult the manufacturer's heat sink selection guide for more information.
  • Yes, IXTP44P15T is compatible with lead-free soldering processes. The device is RoHS compliant and can be soldered using lead-free solder alloys with a peak reflow temperature of 260°C.
  • Store IXTP44P15T in a dry, cool place away from direct sunlight. Handle the devices by the body, avoiding touching the leads or die. Use anti-static packaging and follow ESD handling procedures to prevent damage.

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IXTP44P15T Overview

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