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IXTQ170N10P - LITTELFUSE

Description: MOSFET 170 Amps 100V 0.009 Ohm Rds

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PCB Footprints
IXTQ170N10P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-3P (IXTQ)
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3D Models
IXTQ170N10P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-3P (IXTQ)
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IXTQ170N10P Details

  • Manufacturer Part Number:

    IXTQ170N10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    2000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    170 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    715 W

  • Pulsed Drain Current-Max (IDM):

    350 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTQ170N10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTQ170N10P is a TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • To ensure reliable operation of the IXTQ170N10P in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The maximum allowed voltage transient for the IXTQ170N10P is 10% above the maximum rated voltage, which is 1000V for this device. However, it is recommended to follow the guidelines provided in the datasheet for voltage transient protection.
  • Yes, the IXTQ170N10P can be used in a parallel configuration to increase current handling, but it is recommended to follow proper design and layout guidelines to ensure equal current sharing and to minimize thermal and electrical stresses.
  • The recommended gate drive voltage for the IXTQ170N10P is 10V to 15V, with a maximum gate drive current of 5A. However, the optimal gate drive voltage and current may vary depending on the specific application and requirements.

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IXTQ170N10P Overview

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