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IXTT10P60 - LITTELFUSE

Description: Trans MOSFET P-CH Si 600V 10A 3-Pin(2+Tab) TO-268

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PCB Footprints
IXTT10P60 - LITTELFUSE PCB footprint - Other - Other - IXTT10P60-1
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3D Models
IXTT10P60 - LITTELFUSE  - 3D model - Other - IXTT10P60-1
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IXTT10P60 Details

  • Manufacturer Part Number:

    IXTT10P60

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.25

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    157 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTT10P60 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT10P60 is a standard TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • While the IXTT10P60 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz with proper PCB layout and design considerations. However, it's essential to consult with Littelfuse's application engineers for specific guidance.
  • The IXTT10P60 is designed to handle high surge currents up to 100 A for 10 ms. However, it's crucial to ensure that the device is properly cooled and that the PCB design can handle the thermal stress generated by the surge current.
  • Yes, the IXTT10P60 is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature guidelines to ensure reliable assembly.
  • The typical thermal resistance of the IXTT10P60 is 2.5°C/W (junction-to-case) and 10°C/W (junction-to-ambient) when mounted on a standard FR4 PCB with a copper heat sink.

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IXTT10P60 Overview

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