The recommended PCB footprint for the IXTT120N15P is a TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
Yes, the IXTT120N15P is designed for high-reliability applications and meets the requirements of AEC-Q101, a standard for automotive-grade components.
To ensure proper cooling, the IXTT120N15P should be mounted on a heat sink with a thermal resistance of less than 1°C/W, and the ambient temperature should be kept below 50°C.
The maximum allowed voltage transient for the IXTT120N15P is 150V for a duration of less than 10ms, as specified in the datasheet.
Yes, the IXTT120N15P can be used in a parallel configuration to increase current handling, but it is recommended to use a current sharing scheme to ensure equal current distribution among the devices.
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IXTT120N15P Overview
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