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IXTT2N170D2 - LITTELFUSE

Description: N-Channel, Depletion Mode 1700 V 2A (Tj) 568W (Tc) Surface Mount TO-268AA

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Symbol
IXTT2N170D2 - LITTELFUSE - PCB symbol
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PCB Footprints
IXTT2N170D2 - LITTELFUSE PCB footprint - Other - Other - TO-268 (IXTT)_2025-1.5
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3D Models
IXTT2N170D2 - LITTELFUSE - 3D model - Other - TO-268 (IXTT)_2025-1.5
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IXTT2N170D2 Details

  • Manufacturer Part Number:

    IXTT2N170D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    6.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    80 pF

  • JEDEC-95 Code:

    TO-268AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    568 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTT2N170D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTT2N170D2 is a standard TO-220 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 4.5mm x 4.5mm.
  • Yes, the IXTT2N170D2 is suitable for high-frequency switching applications up to 100 kHz due to its low switching losses and fast switching times.
  • To ensure reliable operation of the IXTT2N170D2 in high-temperature environments, it is recommended to use a heat sink with a thermal resistance of less than 10°C/W and to keep the junction temperature below 150°C.
  • The maximum allowed voltage transient for the IXTT2N170D2 is 200V for a duration of less than 10ms, as specified in the datasheet.
  • Yes, the IXTT2N170D2 can be paralleled to increase current handling, but it is recommended to use a current sharing scheme to ensure equal current distribution and to avoid thermal runaway.

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IXTT2N170D2 Overview

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