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IXTX32P60P - LITTELFUSE

Description: MOSFET -32 Amps -600V 0.350 Rds

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PCB Footprints
IXTX32P60P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247+
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3D Models
IXTX32P60P - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247+
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IXTX32P60P Details

  • Manufacturer Part Number:

    IXTX32P60P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.35 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    77 pF

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    96 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTX32P60P Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it's recommended to use a large copper pad under the device, connect it to a thermal via, and ensure good airflow around the component. A minimum of 2 oz copper thickness is recommended.
  • To select the correct fuse, consider factors such as the maximum current, voltage, and power rating of your circuit. Also, consider the fuse's interrupting rating, melting I²t, and cold resistance. Consult the datasheet and application notes for guidance.
  • The recommended soldering profile for the IXTX32P60P is a peak temperature of 260°C (500°F) for 10-15 seconds, with a ramp-up rate of 3°C/s (5.4°F/s) and a ramp-down rate of 6°C/s (10.8°F/s).
  • Yes, the IXTX32P60P is designed for high-reliability and safety-critical applications. It meets various industry standards, such as UL, CSA, and IEC, and is suitable for use in automotive, industrial, and medical devices.
  • The voltage drop and power loss of the fuse should be considered in your design. Calculate the fuse's voltage drop using the datasheet values and ensure it doesn't affect your circuit's performance. Also, consider the power loss and heat generation when selecting the fuse and designing the PCB.

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IXTX32P60P Overview

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