Please enter a minimum 3 letters or numbers
Technical Content
Part Image

IXTX40P50P - LITTELFUSE

Description: MOSFET -40.0 Amps -500V 0.230 Rds

Download IXTX40P50P Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
IXTX40P50P - LITTELFUSE - PCB symbol
click to zoom
PCB Footprints
IXTX40P50P - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 3-Pin, PLUS247
click to zoom
3D Models
IXTX40P50P - LITTELFUSE - 3D model - Transistor Outline, Vertical - 3-Pin, PLUS247
click to zoom

IXTX40P50P Details

  • Manufacturer Part Number:

    IXTX40P50P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.23 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    93 pF

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    890 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTX40P50P Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a large copper area connected to the thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness and a thermal relief pattern around the thermal pad are also recommended.
  • Yes, the IXTX40P50P is a high-reliability device that meets the requirements of AEC-Q101 and is suitable for use in high-reliability applications, including aerospace and automotive.
  • Littelfuse recommends following the recommended soldering profile and using a solder with a melting point above 217°C (423°F) to ensure reliable connections. Additionally, a soldering iron with a temperature control and a soldering flux can help prevent thermal damage.
  • The IXTX40P50P has a maximum surge current rating of 400A for 10ms, making it suitable for applications that require high surge current capability.
  • Yes, the IXTX40P50P can be used in a parallel configuration to increase the current rating, but it's essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXTX40P50P Overview

Use the download button to access the IXTX40P50P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTX4, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTX40P50P

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑