Part Image

IXTY08N50D2 - LITTELFUSE

Description: N-Channel 500 V 800mA (Tc) 60W (Tc) Surface Mount TO-252AA

Download IXTY08N50D2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
IXTY08N50D2 - LITTELFUSE PCB footprint - Other - Other - IXTY08N50D2-1
click to zoom
3D Models
IXTY08N50D2 - LITTELFUSE  - 3D model - Other - IXTY08N50D2-1
click to zoom

IXTY08N50D2 Details

  • Manufacturer Part Number:

    IXTY08N50D2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Drain-source On Resistance-Max:

    4.6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    11 pF

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

IXTY08N50D2 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTY08N50D2 is a TO-252 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum allowed voltage transient for the IXTY08N50D2 is 650V, as specified in the datasheet. Exceeding this voltage may damage the component.
  • The IXTY08N50D2 is rated for operation up to 150°C. However, it's recommended to derate the component's power handling capability at high temperatures to ensure reliable operation.
  • To calculate the power dissipation of the IXTY08N50D2, use the formula: Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

IXTY08N50D2 Overview

Use the download button to access the IXTY08N50D2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTY0, or try a keyword search, such as Power Field-Effect Transistors

Parts related to IXTY08N50D2

Showing 0 results