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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXTY15P15T
- Part Number IXTY15P15T
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXTY15P15T Details
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Manufacturer Part Number:
IXTY15P15T
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
South Korea
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ECCN Code:
EAR99
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HTS Code:
8541.29.00.95
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Manufacturer:
Littelfuse Inc
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YTEOL:
5.97
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
300 mJ
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Case Connection:
DRAIN
IXTY15P15T Frequently Asked Questions (FAQs)
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The recommended PCB footprint for IXTY15P15T is a standard SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a thermal pad size of 2.5mm x 2.5mm.
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Yes, IXTY15P15T is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature and that the PCB and surrounding components can also withstand the high temperatures.
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To ensure the reliability of IXTY15P15T in high-reliability applications, follow proper handling and storage procedures, use a clean and dry PCB assembly process, and ensure that the device is operated within its recommended specifications. Additionally, consider using a thermally conductive interface material and a heat sink to reduce thermal stress.
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Yes, IXTY15P15T is AEC-Q101 qualified, making it suitable for automotive applications. However, it's essential to ensure that the device meets the specific requirements of the automotive system and that it's properly validated and tested for the intended application.
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The recommended soldering profile for IXTY15P15T is a peak temperature of 260°C for 10-30 seconds, with a maximum temperature ramp rate of 3°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.
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IXTY15P15T Overview
Use the download button to access the IXTY15P15T 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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