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IXYN100N120C3H1 - LITTELFUSE

Description: Trans IGBT Chip N-CH 1200V 140A 690W 4-Pin SOT-227B

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IXYN100N120C3H1 - LITTELFUSE  - 3D model
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IXYN100N120C3H1 Details

  • Manufacturer Part Number:

    IXYN100N120C3H1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.35

  • Additional Feature:

    AVALANCHE RATED

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    134 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-PUFM-X4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    690 W

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    265 ns

  • Turn-on Time-Nom (ton):

    122 ns

IXYN100N120C3H1 Frequently Asked Questions (FAQs)

  • The recommended mounting torque is 10-15 Nm (7-11 lbf-ft) for the IXYN100N120C3H1. It's essential to follow the recommended torque to ensure proper heat transfer and to prevent damage to the device.
  • While the IXYN100N120C3H1 is suitable for high-voltage applications, it's not optimized for high-frequency switching. The device is designed for 50/60 Hz AC applications, and using it in high-frequency applications may lead to reduced performance, increased losses, and potential reliability issues.
  • To ensure proper heat sinking, use a heat sink with a thermal resistance of ≤ 0.5°C/W. Apply a thin layer of thermal interface material (TIM) to the device's base plate, and ensure the heat sink is securely fastened to the device using the recommended mounting torque.
  • The maximum allowed case temperature for the IXYN100N120C3H1 is 110°C. Operating the device above this temperature may lead to reduced performance, increased thermal resistance, and potential reliability issues.
  • The IXYN100N120C3H1 is designed for AC applications, and using it in a DC application may lead to reduced performance, increased losses, and potential reliability issues. If you need a thyristor for a DC application, consider using a device specifically designed for DC applications.

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IXYN100N120C3H1 Overview

Use the download button to access the IXYN100N120C3H1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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