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IXYX50N170C - LITTELFUSE

Description: IGBT - 1700 V 178 A 1500 W Through Hole PLUS247™-3

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PCB Footprints
IXYX50N170C - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - PLUS247-2021
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3D Models
IXYX50N170C - LITTELFUSE  - 3D model - Transistor Outline, Vertical - PLUS247-2021
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IXYX50N170C Details

  • Manufacturer Part Number:

    IXYX50N170C

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    178 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    SINGLE

  • Gate-Emitter Thr Voltage-Max:

    5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-PSIP-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1500 W

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    396 ns

  • Turn-on Time-Nom (ton):

    62 ns

  • VCEsat-Max:

    3.7 V

IXYX50N170C Frequently Asked Questions (FAQs)

  • The recommended mounting torque for the IXYX50N170C is 10-15 in-lbs (1.1-1.7 Nm) for the screw terminals and 15-20 in-lbs (1.7-2.3 Nm) for the nut and washer.
  • While the IXYX50N170C is suitable for high-voltage applications, it's not recommended for high-frequency switching due to its relatively high switching time (tq) of 10-20 μs. For high-frequency applications, consider using a thyristor with a faster switching time.
  • To ensure proper heat sinking, use a heat sink with a thermal resistance of ≤ 1°C/W and apply a thin layer of thermal interface material (TIM) between the device and the heat sink. Also, ensure good airflow around the heat sink.
  • The maximum allowable case temperature for the IXYX50N170C is 125°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, you can use multiple IXYX50N170C devices in parallel to increase current handling. However, ensure that each device is properly matched and that the gate signals are synchronized to prevent uneven current sharing.

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