The recommended PCB footprint for the JLLN100.V is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
Yes, the JLLN100.V is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
The JLLN100.V is designed to handle surge currents up to 100A, with a maximum surge current duration of 10ms. However, repeated surge events may affect the device's lifespan.
Yes, the JLLN100.V is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
The typical response time of the JLLN100.V is less than 1μs, making it suitable for fast-switching applications.
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JLLN100.V Overview
Use the download button to access the JLLN100.V 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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