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JM38510/33004BCA - Texas Instruments

Description: 54F20 DUAL 4-INPUT POSITIVE-NAND

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JM38510/33004BCA - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J0014A
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JM38510/33004BCA - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J0014A
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JM38510/33004BCA Details

  • Manufacturer Part Number:

    JM38510/33004BCA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    CDIP-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    F/FAST

  • JESD-30 Code:

    R-GDIP-T14

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    NAND GATE

  • Max I(ol):

    0.001 A

  • Number of Functions:

    2

  • Number of Inputs:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    5.1 mA

  • Prop. Delay@Nom-Sup:

    7 ns

  • Propagation Delay (tpd):

    7 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Screening Level:

    MIL-M-38510 Class B

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

JM38510/33004BCA Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for JM38510/33004BCA is -55°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range for extended periods.
  • To ensure the reliability of JM38510/33004BCA in high-reliability applications, it's crucial to follow proper design, manufacturing, and testing procedures. This includes adhering to the recommended operating conditions, using proper PCB layout and thermal management, and performing thorough testing and validation.
  • Yes, JM38510/33004BCA is designed to be radiation-hardened and can be used in applications that require resistance to radiation. However, it's essential to consult with Texas Instruments and follow their guidelines for radiation-hardened designs to ensure the device meets the specific requirements of your application.
  • The maximum power dissipation for JM38510/33004BCA is dependent on the operating conditions and package type. According to the datasheet, the maximum power dissipation is 1.5 W for the CQFP package and 1.2 W for the CDIP package. However, it's essential to perform thermal analysis and design for proper heat dissipation to ensure the device operates within its recommended specifications.
  • To troubleshoot issues with JM38510/33004BCA, start by consulting the datasheet and application notes. Check for proper power supply, clock signal, and input/output connections. Use oscilloscopes and logic analyzers to debug the device's behavior. If the issue persists, contact Texas Instruments' technical support for further assistance.

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JM38510/33004BCA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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