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K1500GURP - LITTELFUSE

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K1500GURP - LITTELFUSE  - 3D model
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K1500GURP Details

  • Manufacturer Part Number:

    K1500GURP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    MATTE TIN

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    SIDAC

K1500GURP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the K1500GURP is a rectangular pad with dimensions of 3.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the K1500GURP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid thermal runaway.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the device, and avoid applying excessive force or pressure during the process.
  • The K1500GURP should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • Yes, the K1500GURP can be used in parallel to increase the current rating, but it's essential to ensure that the devices are properly matched and that the PCB design takes into account the increased current and thermal requirements.

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K1500GURP Overview

Use the download button to access the K1500GURP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like K1500, or try a keyword search, such as SIDACs

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