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K4E6E304EC-EGCG - SAMSUNG

Description: 16Gbit 1.7V~1.95V 1.066GHz LPDDR3 SDRAM FBGA-178 Memory (ICs) RoHS

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Symbol

K4E6E304EC-EGCG - SAMSUNG - PCB symbol

PCB Footprints

K4E6E304EC-EGCG - SAMSUNG PCB footprint - BGA - BGA - 178-Ball Fine pitch Ball Grid Array

3D Models

K4E6E304EC-EGCG - SAMSUNG - 3D model - BGA - 178-Ball Fine pitch Ball Grid Array

Datasheet Download Datasheet
Stock & Prices Price & Stock for K4E6E304EC-EGCG
Part Number K4E6E304EC-EGCG
Manufacturer SAMSUNG
Pin Count 178
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 178-Ball Fine pitch Ball Grid Array
Released Date Jul 20, 2026
Last Modified Date Jul 20, 2026 12:32 PM UTC
Pinout / Pin List Click Here (Member Only)

K4E6E304EC-EGCG Details

Manufacturer Part Number:
K4E6E304EC-EGCG
Manufacturer:
Samsung Electro-Mechanics

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