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K4FBE3D4HM-MGCJ - SAMSUNG

Description: 200FBGA, 10x15 64Mb x32DQ x8banks x2channels

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Symbol

K4FBE3D4HM-MGCJ - SAMSUNG - PCB symbol

PCB Footprints

K4FBE3D4HM-MGCJ - SAMSUNG PCB footprint - BGA - BGA - 200-Ball Fine pitch Ball Grid Array Package_2024

3D Models

K4FBE3D4HM-MGCJ - SAMSUNG - 3D model - BGA - 200-Ball Fine pitch Ball Grid Array Package_2024

Datasheet Download Datasheet
Stock & Prices Price & Stock for K4FBE3D4HM-MGCJ
Part Number K4FBE3D4HM-MGCJ
Manufacturer SAMSUNG
Pin Count 200
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 200-Ball Fine pitch Ball Grid Array Package_2024
Released Date Sep 14, 2024
Last Modified Date Sep 14, 2024 6:56 AM UTC
Pinout / Pin List Click Here (Member Only)

K4FBE3D4HM-MGCJ Details

Manufacturer Part Number:
K4FBE3D4HM-MGCJ
Manufacturer:
Samsung Electro-Mechanics

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