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K4M563233G-HN75 - SAMSUNG

Description: 2M X 32 BIT X 4 BANKS MOBILE SDRAM IN 90FBGA SYNCHRONOUS DRAM 8MX32 5.4NS CMOS PBGA90

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Symbol

K4M563233G-HN75 - SAMSUNG - PCB symbol

PCB Footprints

K4M563233G-HN75 - SAMSUNG PCB footprint - BGA - BGA - 90Ball(6x15) FBGA

3D Models

K4M563233G-HN75 - SAMSUNG - 3D model - BGA - 90Ball(6x15) FBGA

Datasheet Download Datasheet
Stock & Prices Price & Stock for K4M563233G-HN75
Part Number K4M563233G-HN75
Manufacturer SAMSUNG
Pin Count 90
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 90Ball(6x15) FBGA
Released Date Mar 5, 2025
Last Modified Date Mar 8, 2025 10:58 AM UTC
Pinout / Pin List Click Here (Member Only)

K4M563233G-HN75 Details

Manufacturer Part Number:
K4M563233G-HN75
Manufacturer:
Samsung Electro-Mechanics

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