Description:Fast Turn-on Response; Equivalent Full-Range Temperature Coefficient of 50 ppm/°C (Typical); Sink Current Capability: 1.0 to 100 mA; Programmable Output Voltage to 36 V; Temperature Compensated for Operation Over Full Rated Operating Temperature Range; Low Output Noise Voltage; Low Dynamic Output Impedance 0.2 Ω (Typical)
OUTPUT VOLTAGE MAY BE SET TO ANY VALUE BETWEEN 2.5V AND 36V WITH TWO EXTERNAL RESISTORS
Analog IC - Other Type:
TWO TERMINAL VOLTAGE REFERENCE
JESD-30 Code:
R-PDSO-N3
JESD-609 Code:
e3
Length:
2.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
3
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-25 °C
Output Current-Max:
0.1 A
Output Voltage-Max:
2.52 V
Output Voltage-Min:
2.47 V
Output Voltage-Nom:
2.495 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
VSON
Package Equivalence Code:
TO-236
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Surface Mount:
YES
Technology:
BIPOLAR
Temp Coef of Voltage-Max:
61.942 ppm/°C
Temperature Grade:
COMMERCIAL EXTENDED
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Trim/Adjustable Output:
YES
Width:
1.6 mm
KA431SAMF2TF Frequently Asked Questions (FAQs)
For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB has adequate thermal vias and a sufficient copper area for heat dissipation.
To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range (−40°C to +125°C). Also, consider using a heat sink or thermal interface material to improve heat dissipation. Finally, ensure that the PCB is designed with thermal management in mind, including adequate thermal vias and a solid ground plane.
The recommended soldering conditions for the KA431SAMF2TF are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C to 220°C.
To handle ESD protection for the KA431SAMF2TF, ensure that all equipment and personnel are grounded before handling the device. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding direct contact with the die. Also, use ESD-protected packaging and storage materials.
The recommended storage conditions for the KA431SAMF2TF are: temperature range of −40°C to +30°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the devices in their original packaging or in a dry, ESD-protected environment.
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System Verified
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Community Approved
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KA431SAMF2TF Overview
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