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KBP202G-BP - MCC

Description: Bridge Rectifier Single Phase Standard 200 V Through Hole KBP , 1.1 V @ 2 A , 5 µA @ 200 V , -65°C ~ 150°C

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PCB Footprints
KBP202G-BP - MCC PCB footprint - Other - Other - KBP202G-BP-5
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KBP202G-BP - MCC  - 3D model - Other - KBP202G-BP-5
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KBP202G-BP Details

  • Manufacturer Part Number:

    KBP202G-BP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    ROHS COMPLIANT, PLASTIC, GBP, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • Additional Feature:

    UL RECOGNIZED

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSIP-T4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    60 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    BULK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

KBP202G-BP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad under the package, using a minimum of 2 oz copper thickness, and ensuring a minimum of 1 mm clearance around the package for airflow.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good airflow around the device.
  • The recommended soldering conditions for the KBP202G-BP are a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C.
  • Yes, the KBP202G-BP is lead-free and RoHS compliant, making it suitable for use in lead-free soldering processes.
  • The typical junction-to-case thermal resistance of the KBP202G-BP is 1.5°C/W, but this can vary depending on the specific application and PCB layout.

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KBP202G-BP Overview

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