28.60 X 28.60 MM, 7.39 MM HEIGHT, ROHS COMPLIANT PACKAGE-4
Pin Count:
4
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Diotec Semiconductor AG
YTEOL:
0
Case Connection:
ISOLATED
Configuration:
BRIDGE, 4 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF):
1.2 V
JESD-30 Code:
S-PUFM-W4
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
300 A
Number of Elements:
4
Number of Phases:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-50 °C
Output Current-Max:
25 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
200 V
Reverse Current-Max:
10 µA
Reverse Recovery Time-Max:
1.5 µs
Reverse Test Voltage:
200 V
Surface Mount:
NO
Terminal Form:
WIRE
Terminal Position:
UPPER
KBPC2502I Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing the device on a copper plane with a minimum area of 1 cm², and ensuring good thermal conductivity between the device and the PCB. A thermal via array under the device can also help to dissipate heat more efficiently.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, and to ensure good thermal management through proper PCB design and heat sinking. Additionally, the device should be operated within its specified maximum junction temperature (Tj) of 150°C.
The recommended soldering conditions for the KBPC2502I involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 2 to 3 seconds. The device should be soldered using a solder with a melting point of 180°C to 220°C.
To protect the KBPC2502I from electrical overstress (EOS), it is essential to follow proper handling and storage procedures, and to ensure that the device is operated within its specified maximum ratings. Additionally, the use of surge protection devices and overvoltage protection circuits can help to prevent EOS damage.
The recommended storage and handling procedures for the KBPC2502I involve storing the devices in their original packaging, away from direct sunlight and moisture. The devices should be handled using anti-static wrist straps or mats, and should not be exposed to temperatures above 40°C or humidity above 60%.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
KBPC2502I Overview
Use the download button to access the KBPC2502I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like KBPC2,
or try a keyword search, such as Bridge Rectifier Diodes
