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KBPC3510I - Diotec

Description: Diode Rectifier Bridge Single 1KV 35A Automotive 4-Pin Box

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KBPC3510I - Diotec PCB footprint - Other - Other - KBPC3510I-3
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KBPC3510I - Diotec  - 3D model - Other - KBPC3510I-3
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KBPC3510I Details

  • Manufacturer Part Number:

    KBPC3510I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    28.60 X 28.60 MM, 7.39 MM HEIGHT, ROHS COMPLIANT PACKAGE-4

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-XUFM-W4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    UPPER

KBPC3510I Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a copper plane with a minimum area of 1 cm², and ensuring that the thermal vias are connected to a solid copper ground plane. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current rating according to the temperature derating curve provided in the datasheet. Additionally, ensure good airflow and thermal management around the device to prevent overheating.
  • The recommended soldering profile for the KBPC3510I involves a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 220°C or higher.
  • Yes, the KBPC3510I can be used in a switching power supply application, but it is essential to ensure that the device is operated within its specified voltage and current ratings. Additionally, the device's reverse recovery time and soft recovery characteristics should be considered to prevent voltage spikes and EMI issues.
  • To protect the device from EOS and ESD, it is recommended to use a transient voltage suppressor (TVS) or a metal oxide varistor (MOV) in parallel with the device. Additionally, ensure that the device is handled and stored in an ESD-safe environment, and that all personnel handling the device wear ESD-protective wrist straps or clothing.

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KBPC3510I Overview

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