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KCM55TR71E336MH01L - Murata Electronics

Description: MURATA - KCM55TR71E336MH01L - CAP, 33UF, 25V, MLCC STACKED, 2220

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PCB Footprints
KCM55TR71E336MH01L - Murata Electronics PCB footprint - Other - Other - KCM55_2025-1
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KCM55TR71E336MH01L Details

  • Manufacturer Part Number:

    KCM55TR71E336MH01L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Murata Manufacturing Co Ltd

  • YTEOL:

    3

  • Capacitance:

    33 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    4.8 mm

  • JESD-609 Code:

    e3

  • Length:

    6.1 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    20%

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    180mm Reel Embossed Tape

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    25 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    5750M/2220

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    5.3 mm

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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KCM55TR71E336MH01L Overview

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About Murata Electronics

Murata Manufacturing Co., Ltd. is a Japanese multinational company that specializes in the design, manufacturing, and sale of electronic components and solutions. Murata offers a wide range of electronic components and modules that are used in various industries and applications. Some of their key product categories include: capacitors, inductors, resistors, sensors, rf components and modules, and power devices.

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