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KDZTR10B - ROHM Semiconductor

Description: Zener Diode: ROHM's zener diodes are available in various lineup as 2-pin mold surfacemount type and complex type.

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KDZTR10B - ROHM Semiconductor PCB footprint - Other - Other - PMDU
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KDZTR10B - ROHM Semiconductor  - 3D model - Other - PMDU
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KDZTR10B Details

  • Manufacturer Part Number:

    KDZTR10B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    6 Ω

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1 W

  • Reference Voltage-Nom:

    10 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2.9%

  • Working Test Current:

    40 mA

KDZTR10B Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. Additionally, keeping the component placement and routing away from the thermal pad can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, derating the device's power consumption and using a thermally conductive adhesive can help improve reliability.
  • To prevent damage, handle the device by the body and avoid touching the pins or leads. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use anti-static packaging and handling procedures to prevent electrostatic discharge damage.
  • To troubleshoot issues, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly soldered and that there are no signs of physical damage. Use a thermal camera or thermometer to check for overheating, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the KDZTR10B in a high-reliability or safety-critical application, consider the device's failure modes, fault tolerance, and redundancy. Ensure that the device is properly derated, and that the system is designed to detect and respond to faults. Additionally, follow relevant industry standards and guidelines for safety-critical designs.

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KDZTR10B Overview

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