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KDZVTFTR10B - ROHM Semiconductor

Description: 1W 10V, SOD-123FL, High Power Zener Diode for Automotive

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PCB Footprints
KDZVTFTR10B - ROHM Semiconductor PCB footprint - Other - Other - KDZVTFTR10B-2
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KDZVTFTR10B - ROHM Semiconductor  - 3D model - Other - KDZVTFTR10B-2
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KDZVTFTR10B Details

  • Manufacturer Part Number:

    KDZVTFTR10B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.65

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    10 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5.66%

  • Working Test Current:

    40 mA

KDZVTFTR10B Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. Additionally, keeping the component away from other heat sources and using a heat sink can improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, derating the device's power consumption and using a thermally conductive adhesive can help.
  • To prevent damage, handle the device by the body and not the leads, avoid bending or twisting the leads, and store the device in a dry, cool place away from direct sunlight. It's also essential to follow the recommended storage temperature and humidity ranges.
  • To troubleshoot issues, start by checking the device's operating conditions, such as temperature, voltage, and current. Verify that the device is used within the recommended operating ranges and that the PCB layout is correct. Use thermal imaging or temperature measurement tools to identify hotspots, and consult the datasheet and application notes for guidance.
  • When using the device in a high-reliability or safety-critical application, consider the device's failure modes, fault tolerance, and redundancy. Ensure that the device is used within its recommended operating conditions, and follow relevant industry standards and guidelines for safety-critical designs.

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KDZVTFTR10B Overview

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