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KDZVTFTR33B - ROHM Semiconductor

Description: 1W 33V, SOD-123FL, High Power Zener Diode for Automotive

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KDZVTFTR33B - ROHM Semiconductor PCB footprint - Other - Other - KDZVTFTR33B-1
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KDZVTFTR33B - ROHM Semiconductor  - 3D model - Other - KDZVTFTR33B-1
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KDZVTFTR33B Details

  • Manufacturer Part Number:

    KDZVTFTR33B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.65

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    33 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5.71%

  • Working Test Current:

    10 mA

KDZVTFTR33B Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Use a heat sink or thermal interface material to keep the junction temperature below 150°C. Also, ensure good airflow and avoid blocking the thermal pad.
  • The maximum allowed voltage on the input pins is 6.5V, exceeding which may cause damage to the device.
  • Yes, the KDZVTFTR33B is suitable for high-frequency switching applications up to 1MHz, but ensure proper PCB layout and decoupling to minimize EMI and ringing.
  • Use ESD-safe handling and assembly procedures, and consider adding external ESD protection devices if the device will be exposed to ESD risks during operation.

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