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KDZVTR13B - ROHM Semiconductor

Description: 1W 13V, SOD-123FL, High Power Zener Diode

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PCB Footprints
KDZVTR13B - ROHM Semiconductor PCB footprint - Other - Other - KDZVTR13B-1
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3D Models
KDZVTR13B - ROHM Semiconductor  - 3D model - Other - KDZVTR13B-1
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KDZVTR13B Details

  • Manufacturer Part Number:

    KDZVTR13B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.65

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    6.01%

  • Working Test Current:

    20 mA

KDZVTR13B Frequently Asked Questions (FAQs)

  • A good PCB layout for the KDZVTR13B should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range (up to 150°C). Implement proper thermal management, such as heat sinks or thermal pads, and consider derating the device's power handling at high temperatures.
  • For reliable soldering, follow the recommended soldering conditions: peak temperature 260°C, soldering time 10 seconds, and preheating temperature 120°C to 150°C. Use a solder with a melting point above 217°C to ensure reliable joints.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an anti-static wrist strap. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, and follow proper ESD handling procedures during assembly and testing.
  • Store the KDZVTR13B in a dry, cool place (temperature range: 5°C to 30°C, humidity < 60%). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage.

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KDZVTR13B Overview

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