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KDZVTR33B - ROHM Semiconductor

Description: 1W 33V, SOD-123FL, High Power Zener Diode

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PCB Footprints
KDZVTR33B - ROHM Semiconductor PCB footprint - Other - Other - KDZVTR33B-1
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KDZVTR33B - ROHM Semiconductor  - 3D model - Other - KDZVTR33B-1
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KDZVTR33B Details

  • Manufacturer Part Number:

    KDZVTR33B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-109B, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.65

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Voltage-Nom:

    33 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5.71%

  • Working Test Current:

    10 mA

KDZVTR33B Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the KDZVTR33B is -40°C to 125°C.
  • To ensure reliability, follow the recommended derating guidelines, use a heat sink if necessary, and ensure good thermal design and layout.
  • The maximum allowable power dissipation for the KDZVTR33B is 1.5W. Exceeding this limit may cause damage to the device.
  • Yes, the KDZVTR33B is suitable for high-frequency applications up to 100MHz. However, ensure proper PCB design and layout to minimize parasitic effects.
  • Follow proper ESD handling procedures, use anti-static wrist straps and mats, and ensure that all equipment is grounded to prevent damage from electrostatic discharge.

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